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Information
- 176-layer 3D TLC NAND technology for high-density storage
- High reliability with a MTBF of 2,500,000 hours
- High internal data rate of 14500 MBps for rapid data access and transfer
- Robust shock and vibration tolerance ensures data integrity in challenging environments
- Energy-efficient design with a power consumption of just 5 W in active mode
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Specifikation
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